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Browse Prior Art Database

Redundant Conductor Paths Embedded within Solder Joints

IP.com Disclosure Number: IPCOM000114403D
Original Publication Date: 1994-Dec-01
Included in the Prior Art Database: 2005-Mar-28
Document File: 2 page(s) / 24K

Publishing Venue

IBM

Related People

Malia, MJ: AUTHOR

Abstract

The surface mounting of electronic components on printed wiring boards has a long term failure mode of solder joint working and ultimate solder joint failure due to crack propagation through the solder joint.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Redundant Conductor Paths Embedded within Solder Joints

      The surface mounting of electronic components on printed
wiring boards has a long term failure mode of solder joint working
and
ultimate solder joint failure due to crack propagation through the
solder joint.

      Increase long term electrical connection reliability is
accomplished using a redundant connection from the surface mounted
component to the printed wiring board mounting surface, using a
CONDUCTIVE FILLER material WITHIN the SOLDER to be used for the
solder joints.

      Using the failure mode of solder working, crack development and
then crack propagation until electrical failure, this approach
extends the electrical life of the solder joint.  Using solder filled
with a stranded conductive material may not preclude the solder from
working and initiate crack propagation, but would create many
electrical paths through the solder which would jumper across the
cracked joint.