Browse Prior Art Database

Fabrication of Fine Coil Pattern for Thin Film Head

IP.com Disclosure Number: IPCOM000114443D
Original Publication Date: 1994-Dec-01
Included in the Prior Art Database: 2005-Mar-28
Document File: 2 page(s) / 59K

Publishing Venue

IBM

Related People

Umezaki, H: AUTHOR

Abstract

Disclosed is a fabrication method for fine coil pattern used in thin film magnetic recording head.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 60% of the total text.

Fabrication of Fine Coil Pattern for Thin Film Head

      Disclosed is a fabrication method for fine coil pattern used in
thin film magnetic recording head.

      The Cu coils are delineated by ion milling using thin Ti masks
which are obtained by lift-off of polymer patterns formed by
tri-layer resist process.

      Fine coil patterns as small as 1.5 um line & space can be
obtained over a large step due to planarizing effect of the tri-layer
resist.  And the thin Ti mask makes it possible to delineate a fine
coil pattern and also there is no fencing after ion milling which
occasionally seen in conventional ion milling.

      The Figure shows a process sequence of present disclosure.
First, the Cr/Cu/Cr film is deposited across over the large step.

Then the tri-layer resists are formed, that is, a bottom layer
(resist), an intermediate layer (Ti) and a top layer (resist).

      Since the top layer resist is formed on a flat surface, a fine
pattern can be delineated even by a conventional lithograph (Fig. a).

      The top layer resist patterns are then transferred to the
intermediate layer and the bottom layer by a Reactive Ion Etching
(RIE) using SF6 for Ti and O2 for resist, respectively (Fig. b).

      The Ti film is then deposited (Fig. c) and the Ti layer over
the bottom resist is removed by lift-off (Fig. d).

      Remaining Ti layer over the Cr/Cu/Cr film is used as an etching
mask for Cu coil ion milling (Fig. e).

      S...