Browse Prior Art Database

No Clean, Direct Access Storage Device Compatible Thermode Soldering Process

IP.com Disclosure Number: IPCOM000114458D
Original Publication Date: 1994-Dec-01
Included in the Prior Art Database: 2005-Mar-28
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Hoffmeyer, MK: AUTHOR [+3]

Abstract

A cost effective, high yield, computer disk enclosure compatible, no clean Surface Mount Technology (SMT) solder process for attach of electronic subassemblies, to circuit boards, flex, and other carrier materials is disclosed. The solder process provides both chemical and particulate compatibility with head and disk assemblies within the Disk Enclosure (DE) of Direct Access Storage Devices (DASD) without use of subsequent cleaning prior to installation of devices into the DE. The process can also be adapted to many other electronic packaging applications where similar, strict particulate and chemical contamination control limits are essential for consistent assembly performance and reliability.

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This is the abbreviated version, containing approximately 55% of the total text.

No Clean, Direct Access Storage Device Compatible Thermode Soldering
Process

      A cost effective, high yield, computer disk enclosure
compatible, no clean Surface Mount Technology (SMT) solder process
for attach of electronic subassemblies, to circuit boards, flex, and
other carrier materials is disclosed.  The solder process provides
both chemical and particulate compatibility with head and disk
assemblies within the Disk Enclosure (DE) of Direct Access Storage
Devices (DASD) without use of subsequent cleaning prior to
installation of devices into the DE.  The process can also be adapted
to  many other electronic packaging applications where similar,
strict particulate and chemical contamination control limits are
essential for consistent assembly performance and reliability.

      A custom designed, heated gas purge window, controller, and gas
flow system was added to a commercially available thermode soldering
tool used for hot bar attach SMT soldering of circuit subassemblies.
A no clean DASD/DE compatible soldering process was developed using
this tool.  In the process, the gas window automatically drops into
position over the parts to be joined and delivers a purge of hot N2
or reactive gas mixture to the part surfaces thru slots in the gas
window.  The directed hot gas flow provides additional preheat to the
part and excludes air from the immediate area to be soldered.  Prior
to delivery of gas to the part surface, the tacked subassemblies are
place...