Browse Prior Art Database

Overwrapped Footprint for Integrated Circuit

IP.com Disclosure Number: IPCOM000114474D
Original Publication Date: 1994-Dec-01
Included in the Prior Art Database: 2005-Mar-28
Document File: 2 page(s) / 24K

Publishing Venue

IBM

Related People

Amano, Y: AUTHOR [+2]

Abstract

This article describes how to put two IC chips selectably at the same position on a printed circuit board. With overwrapping IC position, different IC chips can be placed at the same position.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Overwrapped Footprint for Integrated Circuit

      This article describes how to put two IC chips selectably at
the same position on a printed circuit board.  With overwrapping IC
position, different IC chips can be placed at the same position.

      Fig. 1 shows a footprint of two IC chips, and Fig. 2 shows an
overwrapped footprint of two IC chips.  By this placement, two
different IC chips which have the same kind of function with
different packages like memory chips can be placed selectably.

This method can be used for placing more than two IC chips.