Browse Prior Art Database

System Shutdown during Microprocessor Cooling Failure

IP.com Disclosure Number: IPCOM000114498D
Original Publication Date: 1994-Dec-01
Included in the Prior Art Database: 2005-Mar-28
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Bernstrom, GG: AUTHOR [+3]

Abstract

Disclosed is the use of a temperature-sensing device, attached to the heat sink of a microprocessor chip using local forced air cooling, to shut down a computing system in the event that the heat sink reaches a temperature exceeding a pre-determined limit. In this way, the destruction of an expensive microprocessor chip is prevented in the event of an over-temperature condition resulting particularly from a failure of the local forced air cooling.

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This is the abbreviated version, containing approximately 83% of the total text.

System Shutdown during Microprocessor Cooling Failure

      Disclosed is the use of a temperature-sensing device, attached
to the heat sink of a microprocessor chip using local forced air
cooling, to shut down a computing system in the event that the heat
sink reaches a temperature exceeding a pre-determined limit.  In this
way, the destruction of an expensive microprocessor chip is prevented
in the event of an over-temperature condition resulting particularly
from a failure of the local forced air cooling.

      High-speed microprocessors require significant increases in the
power which must be dissipated by the microprocessor during
operation.  In some applications, the use of a passive heat sink to
cool such a microprocessor with air moved by the general cooling
system is not adequate to prevent the damage and destruction of the
microprocessor by excessive operating temperatures.  In such a
system, an additional, local forced-air system, consisting of a small
fan blowing air directly on a heat sink attached to the
microprocessor, is provided.  However, if such a local cooling system
fails, the microprocessor may be quickly destroyed.

      To prevent this occurrence, the assembly consisting of the
microprocessor and the heat sink is augmented with a
temperature-sensing device, such as a thermistor, which can signal an
over-temperature condition to effect a system shut-down.  The system
can be shut down, for example, as the over-temperature sense signal...