Browse Prior Art Database

Three-Dimensional High Density Packaging

IP.com Disclosure Number: IPCOM000114578D
Original Publication Date: 1995-Jan-01
Included in the Prior Art Database: 2005-Mar-29
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Wada, T: AUTHOR [+2]

Abstract

Disclosed is a high density tape carrier pacakge in which a tape carrier with chips mounted thereon is folded to form a three dimensional assembly as shown in Figs. 1 and 2.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Three-Dimensional High Density Packaging

      Disclosed is a high density tape carrier pacakge in which a
tape carrier with chips mounted thereon is folded to form a three
dimensional assembly as shown in Figs. 1 and 2.

      A number of chips 10 are mounted on a single long tape carrier
12.  The tape carrier 12 is of conventional design except that pads
14 for I/O connection are formed at one end of the tape, that slots
16 are formed between chip mounting sites 18 to facilitate folding of
the tape and that connection lines 20 extend from chips through the
slots 16 to the pads 14.  After mounting of the chips, the tape 12 is
folded to form a three dimensional package as shown in Fig. 3.  The
folded tape is bundled by heat resistant tapes 22 which also act to
protect the connection lines 20 exposed at the slots 16.  The folded
tape stack is then mounted on substrate 24 such that the pads 14 are
soldered to the conductors on the substrate 24 to provide I/O
connections as shown in Figs. 3 - 5.