Browse Prior Art Database

Structure of High Density of Surface Laminar Circuit

IP.com Disclosure Number: IPCOM000114628D
Original Publication Date: 1995-Jan-01
Included in the Prior Art Database: 2005-Mar-29
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Shirai, M: AUTHOR [+4]

Abstract

This article describes a fabrication method of high density Surface Laminar Circuit (SLC) structure with solid via connection for routing. The solid via hole connection is formed to get high density by small size via diameter, no via land and direct connection of top via to bottom via.

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Structure of High Density of Surface Laminar Circuit

      This article describes a fabrication method of high density
Surface Laminar Circuit (SLC) structure with solid via connection for
routing.  The solid via hole connection is formed to get high density
by small size via diameter, no via land and direct connection of top
via to bottom via.

The Figures show cross sectional views at each fabrication stage as a
typical example.
  Fig. 1.  Substrate and surface preparation
  Fig. 2.  First copper stud build seeding, electroless plating,
            plating resist, electritic plating, (polish), resist
remove
            and flash etch.
  Fig. 3.  First insulator coat coat and polish
  Fig. 4.  Second circuit pattern build seeding, electroless plating,
            eletrolytic copper plating and circutizing.
  Fig. 5.  Second copper stud build seeding, electroless plating,
            plating resist, electritic plating, (polish), resist
            remove and flash etch.
  Fig. 6.  Second insulator coat repeating of step 3.
  Fig. 7.  Drilling
  Fig. 8.  Third circuit pattern build repeating of step 4.
  Fig. 9.  Component pad and PTH build repeating of step 5.
  Fig. 10.  Third insulating coat repeating of step 3.