Browse Prior Art Database

Dynamic Load/Unload Suspension Assembly for Magneto-Resistive Slider

IP.com Disclosure Number: IPCOM000114800D
Original Publication Date: 1995-Feb-01
Included in the Prior Art Database: 2005-Mar-29
Document File: 4 page(s) / 69K

Publishing Venue

IBM

Related People

Albrecht, DW: AUTHOR [+2]

Abstract

Disclosed is a Dynamic Load/Unload Head Suspension Assembly (HSA) design used in Hard Disk Drives with Magneto-Resistive (MR) slider.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 86% of the total text.

Dynamic Load/Unload Suspension Assembly for Magneto-Resistive Slider

      Disclosed is a Dynamic Load/Unload Head Suspension Assembly
(HSA) design used in Hard Disk Drives with Magneto-Resistive (MR)
slider.

      Usually the shape of Head Wire Loop from MR Slider to
Suspension Assembly is vertical shown in Fig. 1 because 4 pieces of
the Ultra Sonic or Soldering Pads are located horizontally.

      If an HSA with a Dynamic Load/Unload feature is tried, vertical
Head Wire Loop shape cannot be used because these wires might touch
the Dynamic Load/Unload feature.

      If a narrow enough Dynamic Load/Unload feature can be made that
locates between Head Wires, a current vertical Head Wire Loop shape
may be used.  However, because the Dynamic Load/Unload feature is
very narrow, it is very weak.  Therefore, it doesn't work well as a
Dynamic Load/Unload feature.

      In order to solve this problem, a new Load/Unload feature was
designed and is shown in Figs. 2, 3 and 4.  The New Suspension
Assembly has a Stiffener that is welded on the narrow Load/Unload
feature.  As the Stiffener has press forming, it improves the
stiffness of the Dynamic Load/Unload feature significantly so a
narrow Load/Unload feature can be achieved.  In Fig. 4, some
variations of cross section of the Stiffener are shown.  A dimple may
be added at the far end of Load Beam for Dynamic Load/Unloading as an
option.  The Head Wires might be bonded on the Load Beam by
adhesives.  I...