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Heatsink Removal Tool

IP.com Disclosure Number: IPCOM000114851D
Original Publication Date: 1995-Feb-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Becker, DJ: AUTHOR [+3]

Abstract

Described is a heatsink removal tool which provides a method for removing a variety of heatsinks from Integrated Circuit (IC) packages. The hand operated tool delivers a force at the interface between the top of the integrated circuit package and the heatsink. A bevel shaped blade directed at the interface material separates the heatsink from the package.

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Heatsink Removal Tool

      Described is a heatsink removal tool which provides a method
for removing a variety of heatsinks from Integrated Circuit (IC)
packages.  The hand operated tool delivers a force at the interface
between the top of the integrated circuit package and the heatsink.
A bevel shaped blade directed at the interface material separates the
heatsink from the package.

      The Figure shows a side view of the heatsink removal tool.
Removable blades (A) are changed to adapt the tool for various sized
heatsinks or IC packages and their combinations.  The handles (C) are
connected through a threaded shaft (E).  Constant maximum forces can
be applied with manual operation by turning the screw handle (D).
The lower portion (B) of the tool remains parallel as the handles (C)
are opened and closed.  The blades (A) shown here could be used when
the heatsink dimensions are greater than the IC package dimensions.
Other blade combinations may be designed as needed.