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Thin Films Deposition System

IP.com Disclosure Number: IPCOM000114858D
Original Publication Date: 1995-Feb-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Atsumi, M: AUTHOR [+4]

Abstract

Disclosed is a thin films deposition system which has both Chemical Vapor Deposition (CVD) chambers and sputtering chambers. Substrate-transferring paths between these chambers are kept vacuum. This system is to deposit both CVD films and sputtered films successively.

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Thin Films Deposition System

      Disclosed is a thin films deposition system which has both
Chemical Vapor Deposition (CVD) chambers and sputtering chambers.
Substrate-transferring paths between these chambers are kept vacuum.
This system is to deposit both CVD films and sputtered films
successively.

      Fig. 1 shows an example of chamber arrangement for this system.
A large arrow 1 shows the direction of the transferring substrates.
The substrates 2 are loaded from a loading chamber 3.  In this case,
a first film is deposited in the CVD chamber 4 and a second film is
deposited in the sputtering chamber 5.  Then, the substrates come out
from an unloading chamber 6 after the deposition.  The transferring
paths 7 between each chambers are kept vacuum.  The most important
point is that the substrates can move through the transferring path 7
from the CVD chamber 4 to the sputtering chamber 5 without exposure
to air.  This system makes it possible to avoid the surface oxidation
or nitrization of the first film.  At the same time, the surface
contamination of the first film is minimized.  In addition, the total
processing time becomes shorter and the total floor area of this
equipment becomes smaller than those of the conventional systems for
which the CVD system and the sputtering system are separate.

      Fig. 2 shows another example for this system.  In this type, a
robot 8 carries the substrates 9 between a loading chamber 10, a CVD
chamber 11, a sp...