Browse Prior Art Database

Rigid Flex Card Direct Separable Connection Method

IP.com Disclosure Number: IPCOM000114861D
Original Publication Date: 1995-Feb-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 6 page(s) / 130K

Publishing Venue

IBM

Related People

Campbell, JS: AUTHOR [+2]

Abstract

This invention relates to the interconnection of circuit boards, cards, multi-chip modules, and the like. Due to the rigid nature of printed circuit boards, cards, and multi-chip modules direct pressure pad-on-pad interconnect of the like is not possible, reasonable force which does not cause harm can not provide a reliable interconnection, due to a wide variation in contact forces. Flexible circuitry and elastomers have been used in conjunction with pad-on-pad connections to provide uniform reliable pressure interconnects between circuit boards, cards, and modules.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Rigid Flex Card Direct Separable Connection Method

      This invention relates to the interconnection of circuit
boards, cards, multi-chip modules, and the like.  Due to the rigid
nature of printed circuit boards, cards, and multi-chip modules
direct pressure pad-on-pad interconnect of the like is not possible,
reasonable force which does not cause harm can not provide a reliable
interconnection, due to a wide variation in contact forces.  Flexible
circuitry and elastomers have been used in conjunction with
pad-on-pad connections to provide uniform reliable pressure
interconnects between circuit boards, cards, and modules.

      Today's manufacturing capability can provide "rigid flex"
cards, which are typical rigid printed circuit cards with thin
flexible layers that can extend beyond the rigid card edge or be
exposed through an open window within the rigid card boundaries.

      The disclosed invention provides a method for utilizing the
flexible layers within rigid flex cards to form direct pad-on-pad
interconnections between rigid flex cards and other printed circuit
cards, boards, rigid flex, multi-chip modules, and the like.

      The disclosed invention is a pad-on-pad connection method
utilizing rigid flex.  A thin flexible layer within a rigid flex card
has contact pads which can be used to form pad-on-pad connections
with other cards, boards, multi-chip modules, etc. due to the
compliant nature of such a thin layer.  The traditional connector,
which forms an intermediate transmission path between connected card,
boards, etc.  is not required with this connection method.

      The disclosed invention is a pad-on-pad connection utilizing
rigid flex cards.  This connection is formed directly between a rigid
flex card and cards, boards, modules, etc., as seen in Figs. 1 and 4.

      In Fig. 1 a Multi-Chip Module (MCM) (2) is shown connected by
separable means t...