Browse Prior Art Database

Method of Fabricating Planarized First Pole-Tip for Merged Magnetoresistance Head

IP.com Disclosure Number: IPCOM000114909D
Original Publication Date: 1995-Feb-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Lo, J: AUTHOR

Abstract

The conventional fabrication process for a merged Magnetoresistive (MR) head results in unacceptable write gap curvature due to the profile of the conductive leads in the end regions of the MR read element. While the use of thinner leads will minimize the write gap curvature, thinner leads cannot eliminate this problem. Further, when thinner leads are used, addition lead stitching steps may be required to lower the overall lead resistance to acceptable values. It is desirable to provide a planarized first pole tip (P1) to allow optimization of the MR read head and eliminate the error rate due to write gap curvature.

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Method of Fabricating Planarized First Pole-Tip for Merged
Magnetoresistance Head

      The conventional fabrication process for a merged
Magnetoresistive (MR) head results in unacceptable write gap
curvature due to the profile of the conductive leads in the end
regions of the MR read element.  While the use of thinner leads will
minimize the write gap curvature, thinner leads cannot eliminate this
problem.  Further, when thinner leads are used, addition lead
stitching steps may be required to lower the overall lead resistance
to acceptable values.  It is desirable to provide a planarized first
pole tip (P1) to allow optimization of the MR read head and eliminate
the error rate due to write gap curvature.

      A fabrication technique to provide a planarized P1 of an MR
merged head which eliminates error rate due to write gap curvature is
described.  In the convention fabrication process, the P1 layer is
initially plated to be somewhat thicker than the final desired
thickness, the surface of the initially plated P1 following the
contours of the underlying MR head.  Then, as outlined below, the
surface is milled to remove the high areas and provide a planarized
P1 surface.
  1.  Form the MR read head with a set of conventional process and
       materials as desired.  Plate P1 using a conventional process
       to be approximately 300nm thicker than the desired P1 target
       thickness.
  2.  Apply photoresist to the plated P1 surface...