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Snap-In Planar Electromagnetic Compatibility Grounding Standoff

IP.com Disclosure Number: IPCOM000114921D
Original Publication Date: 1995-Feb-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Barina, RM: AUTHOR [+4]

Abstract

Described is a stainless steel standoff (Fig. 1) with a snap-in design that enables it to support multiple electronic boards. This is accomplish by providing multiple holes on the frame where the standoff snaps into place. By placing rectangular openings in the frame (Fig. 2) to match the electronic boards, different hole configurations on the electronic board are supported by installing the standoff in the matching hole.

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Snap-In Planar Electromagnetic Compatibility Grounding Standoff

      Described is a stainless steel standoff (Fig. 1) with a snap-in
design that enables it to support multiple electronic boards.  This
is accomplish by providing multiple holes on the frame where the
standoff snaps into place.  By placing rectangular openings in the
frame (Fig. 2) to match the electronic boards, different hole
configurations on the electronic board are supported by installing
the standoff in the matching hole.

      The Standoff has four (4) self cleaning whiping contacts to the
frame (Fig. 3) that provide reliable low impedence Electromagnetic
Compatibility (EMC) ground contacts.  The Standoff also has enlarge
surface contacts that provide an improved high frequency response.

      Fig. 2 illustrates how the standoff is snap into a frame.
Fig. 3 illustrates how the standoff whiping contacts make contact
with
the frame and how the snap-in latches retains it to the frame.  It
also
shows how the enlarge surface area makes contact with an electronic
board.