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Reworkable Encapsulant with Enhanced Solubility

IP.com Disclosure Number: IPCOM000115009D
Original Publication Date: 1995-Mar-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 22K

Publishing Venue

IBM

Related People

Farquhar, DS: AUTHOR [+3]

Abstract

Marked improvement in solubility of epoxy based encapsulants is obtained by decreasing the inorganic filler content. This improvement enables the encapsulant to be removed from the package in the event that rework is required. The removal is accomplished with a combination of mechanical, thermal, and chemical action. The reduction of the encapsulant's filler content to the 20 to 30% range has a dramatic effect in improving the dissolution rate. The corresponding increase in the coefficient of thermal expansion limits the application of the encapsulant less demanding applications, such as plastic packages with J-leads. This provides a reworkable encapsulant which is suitable for some applications.

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Reworkable Encapsulant with Enhanced Solubility

      Marked improvement in solubility of epoxy based encapsulants is
obtained by decreasing the inorganic filler content.  This
improvement enables the encapsulant to be removed from the package in
the event that rework is required.  The removal is accomplished with
a combination of mechanical, thermal, and chemical action.  The
reduction of the encapsulant's filler content to the 20 to 30% range
has a dramatic effect in improving the dissolution rate.  The
corresponding increase in the coefficient of thermal expansion limits
the application of the encapsulant less demanding applications, such
as plastic packages with J-leads.  This provides a reworkable
encapsulant which is suitable for some applications.