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Browse Prior Art Database

High Damping Structural Adhesives

IP.com Disclosure Number: IPCOM000115060D
Original Publication Date: 1995-Mar-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 67K

Publishing Venue

IBM

Related People

Kuczynski, JP: AUTHOR

Abstract

Described is the use of thermoplastic fillers incorporated into structural adhesives which enhance the vibration damping performance of the adhesive by broadening the magnitude of the loss factor over an extended temperature range. Thermoplastic resin-filled structural adhesives exhibit enhanced vibration damping over a 60C window versus a 20C window for the unfilled material. The peel strength of the filled adhesives, although reduced in comparison with virgin material, is more than adequate for numerous structural applications.

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High Damping Structural Adhesives

      Described is the use of thermoplastic fillers incorporated into
structural adhesives which enhance the vibration damping performance
of the adhesive by broadening the magnitude of the loss factor over
an extended temperature range.  Thermoplastic resin-filled structural
adhesives exhibit enhanced vibration damping over a 60C window versus
a 20C window for the unfilled material.  The peel strength of the
filled adhesives, although reduced in comparison with virgin
material,
is more than adequate for numerous structural applications.

      For vibration absorbing materials, the loss factor should be as
high as possible.  Traditional damping materials (such as
viscoelastic pressure sensitive adhesives) exhibit a loss factor
whose magnitude is greater than or equal to 0.4 over a comparatively
broad temperature range.  Unfortunately, these materials invariably
possess low storage modulii, very low glass transition temperatures
(Tg approximately -20C), and are unsuitable for structural
applications.  Biphasic, vibration damping, structural adhesives can
be designed by determining the Tg of the unfilled adhesive, then
selecting appropriate thermoplastics such that the resin Tgs sandwich
the adhesive Tg.  In this manner, the magnitude of the loss factor
can be forced above 0.4 over a broad temperature range (Figure).  The
results illustrated in the Figure are from a sample comprised of a
polyglycol amine-cured epoxy (3M DP 460) filled with equal weight
fractions of poly(isopropyl methacrylate) and poly(isobutyl
methacrylate).  The unfilled, cured (60 min at 80C) epoxy exhibits a
Tg of 60C; poly(isopr...