Browse Prior Art Database

Micropax Grounding Assembly

IP.com Disclosure Number: IPCOM000115175D
Original Publication Date: 1995-Mar-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Anderson, DH: AUTHOR [+3]

Abstract

This device is used to enhance the shielding and grounding performance of the Mircopax* connector.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Micropax Grounding Assembly

      This device is used to enhance the shielding and grounding
performance of the Mircopax* connector.

      The device to improve the performance of the Micropax connector
is made up of finger stock and a finger stock mounting base.  The
finger stock is made of a resilient conductive spring material, such
as beryllium copper.  The finger stock is mounted on a conductive
base which in turn is mounted on a printed circuit board(PCB).  The
mounting base can be either surface mounted or pin thru hole attached
and soldered to the ground plane of the PCB.  This assembly surrounds
the micropax receptacle such that the finger stock makes contact with
the micropax plug when the two halves are mated.  Therefore there is
an independant path from the connector plug shell to the ground plane
on the PCB, and is not dependant on an intimate contact between the
connector halves.
  *  Trademark of Berg Electronics, Inc.