Browse Prior Art Database

Improved Enclosure for Electronic Devices

IP.com Disclosure Number: IPCOM000115243D
Original Publication Date: 1995-Apr-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Stone, RG: AUTHOR

Abstract

Described is a hardware implementation that provides an inexpensive enclosure for electronic devices. The technique utilizes molded case materials, such as polymer, and is insulated with a spray metallic material, such as Spraylat, so as to meet electro-magnetic radiation requirements.

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This is the abbreviated version, containing approximately 100% of the total text.

Improved Enclosure for Electronic Devices

      Described is a hardware implementation that provides an
inexpensive enclosure for electronic devices.  The technique utilizes
molded case materials, such as polymer, and is insulated with a spray
metallic material, such as Spraylat, so as to meet electro-magnetic
radiation requirements.

      The polymer case is first molded flat with the walls of the
base molded down.  A fold line is molded between the panels to
facilitate assembly.  Complex geometry that would normally require
sliders in the mold are molded vertically into the flattened wall.
The fold is executed once, therefore plastic deformation of the
polymer does not fatigue and cause structural weakness.  Using this
approach enables easy application of the spray shielding and masking
since the components are all vertical.

      The concept is typically applied in the hardware design stage.
After gathering the circuit cards and devices to be enclosed, a
molded base is designed with the walls in their folded positions.
After completing the design of ribs and bosses in the case, the case
is unfolded yielding a finished flat part.