Browse Prior Art Database

Wet Process Handling Method for High Performance Cores

IP.com Disclosure Number: IPCOM000115262D
Original Publication Date: 1995-Apr-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Duffy, T: AUTHOR [+6]

Abstract

Disclosed is a method for processing high performance dielectric cores through wet processes. Bath compatibly plastics (e.g., polypro, teflon, etc.) are fashioned into a disk or frame and the thin, fracture-prone dielectric cores are "pinched" between the plastic surfaces. No tearing of the cores takes place since large amounts of force may be exerted on the cores in a compressive mode. Existing handling methodologies (tooling hole, tension rod) are not nearly as successful on these thin high performance cores. These new handling concepts are extendable to future high performance cores where thinness and reduced glass fabric content (strength) are sacrificed for electrical performance.

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Wet Process Handling Method for High Performance Cores

      Disclosed is a method for processing high performance
dielectric cores through wet processes.  Bath compatibly plastics
(e.g., polypro, teflon, etc.) are fashioned into a disk or frame and
the thin, fracture-prone dielectric cores are "pinched" between the
plastic surfaces.  No tearing of the cores takes place since large
amounts of force may be exerted on the cores in a compressive mode.
Existing handling methodologies (tooling hole, tension rod) are not
nearly as successful on these thin high performance cores.  These new
handling concepts are extendable to future high performance cores
where thinness and reduced glass fabric content (strength) are
sacrificed for electrical performance.

      Diagrams of the disk (Fig. 1) and frame (Fig. 2) handling
concepts are illustrated.