Browse Prior Art Database

Very-Low-Cost Single-Mode Optoelectronic Transceiver Package

IP.com Disclosure Number: IPCOM000115282D
Original Publication Date: 1995-Apr-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 80K

Publishing Venue

IBM

Related People

Lasky, RC: AUTHOR [+3]

Abstract

This invention disclosure presents novel packaging concepts intended to drastically reduce the costs of SM optoelectronics. Cost savings will result from: passive alignment techniques and a large-spot optical design, inexpensive plastic piece parts, simplified process flow and integrated packaging.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Very-Low-Cost Single-Mode Optoelectronic Transceiver Package

      This invention disclosure presents novel packaging concepts
intended to drastically reduce the costs of SM optoelectronics.  Cost
savings will result from: passive alignment techniques and a
large-spot optical design, inexpensive plastic piece parts,
simplified process flow and integrated packaging.

      The major components of the VLCSM module, are the optical
platform and bore, the fiber stub assembly, the lens, the laser diode
chip, the monitor photodiode, the laser driver chip, and digital
electronic chips (i.e., serializer, encode chips).  Each of these
components is discussed below.

      The optical platform and bore is the heart of the VLCSM module.
The optical platform and bore is preferably a single injection-molded
high-performance plastic part; but it could, instead be comprised of
an optical platform part fitted to a bore part.

      The optical platform is a planar structure with precision
features tens or hundreds of microns high.  The precision features
are used for passive alignment of the optical components:  the laser,
the lens and the monitor photodiode.  The horizontal precision of the
alignment features is approximately 1 microns over sub-mm distances.
The platform may be circuitized to facilitate the electrical
connections among the laser driver chip, the laser and the monitor
photodiode.

      The bore is a cylindrical structure designed to accommodate the
user's ferrule.  It is injection-molded high-performance plastic.
The bore diameter is 2.5 mm with a tolerance of about 2 microns.

      The high level of tolerance control will b...