Browse Prior Art Database

Integrated Circuit Heatsink for Electronics on Flex Cable

IP.com Disclosure Number: IPCOM000115338D
Original Publication Date: 1995-Apr-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Goodman, DE: AUTHOR [+2]

Abstract

Described is a low-cost Integrated Circuit (IC) heatsink concept that is compatible with Direct Chip Attach (DCA) wirebonded IC's.

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This is the abbreviated version, containing approximately 100% of the total text.

Integrated Circuit Heatsink for Electronics on Flex Cable

      Described is a low-cost Integrated Circuit (IC) heatsink
concept that is compatible with Direct Chip Attach (DCA) wirebonded
IC's.

      The exposed surface area of the heatsink shown in the Figure
and the direct contact with the Integrated Circuit (IC) die allows
for
natural or forced air convection for heat transfer away from the IC.

      The heatsink is mounted to the top of the IC die and protrudes
through the encapsulant material.  The heatsink is held in place with
a thin layer of encapsulant to act as the bond between the heatsink
and the IC, and also by the encapsulation material surrounding the
component.  The heatsink would be treated to be electrically
non-conductive and made from material with optimum thermal
conductivity.