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Browse Prior Art Database

Flexible Applique Rework/Flex Circuit Assembly Processing Stiffener

IP.com Disclosure Number: IPCOM000115368D
Original Publication Date: 1995-Apr-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Best, DP: AUTHOR [+3]

Abstract

A method for processing non-rigid substrate material through standard Surface Mount Technology (SMT) processes is disclosed. This method allows for processing of flexible carriers on equipment designed for rigid carriers.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Flexible Applique Rework/Flex Circuit Assembly Processing Stiffener

      A method for processing non-rigid substrate material through
standard Surface Mount Technology (SMT) processes is disclosed.  This
method allows for processing of flexible carriers on equipment
designed for rigid carriers.

      Standard SMT processing equipment is used to process flexible
carriers with the assembly processing stiffener.  As shown in the
Figure, the overall size of the processing stiffener (1) is
determined by the type of processing equipment being used for
assembly processing.

      The processing stiffener has tooling holes (2) and a unique
pattern (3) depending on the specific type of flexible carrier (4).
In addition, the processing stiffener has a suitable adhesive strip
(5) on the border.

      The flexible carrier is roughly aligned on the processing
stiffener.  The adhesive strip secures the flexible carrier during
processing.  The pattern which has been defined provides the support
to the flexible carriers.  After complete processing thru the normal
SMT assembly equipment and cleaning, the flexible carrier is removed
from the processing stiffener.