Browse Prior Art Database

Repairable/Manufacturable Step Integrated Connector Design for Rio Bravo

IP.com Disclosure Number: IPCOM000115375D
Original Publication Date: 1995-Apr-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Bhatt, AC: AUTHOR [+4]

Abstract

To speed up the communication between modules or modules and other system package components, substrate imbedded flex I/O's are utilized. The drawback with this approach is that no Flex EC & Repair is possible and any flex problems result in discarding the whole substrate, an expensive and indeed undesirable situation.

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Repairable/Manufacturable Step Integrated Connector Design for Rio
Bravo

      To speed up the communication between modules or modules and
other system package components, substrate imbedded flex I/O's are
utilized.  The drawback with this approach is that no Flex EC &
Repair is possible and any flex problems result in discarding the
whole substrate, an expensive and indeed undesirable situation.

      A need exists for a module integrated flex I/O scheme that
provides for EC & repair at a minimum impact on performance.

The proposed Module Integrated Flex I/O's are fabricated in the
following way:

      The Organic Module consists of composites using 2S/1P cores or
any other subcomposite structure.  The cores are made using RO2810
material and processes.

      Each core or subcomposite is wider in X or Y direction,
depending on the desired direction of the communication forming
variable step width according to the I/O's packaging needs.  For
example, the difference between number one signal plane and sixteenth
signal plane will be:
  For 100 mils  =  1.6 inches
  For 250 mils  =  4.0 inches
  For 500 mils  =  8.0 inches

      This approach allows to put flex pads at the end of each core
thus facilitating Flex EC and repair at a minimum impact on
performance.  The one end of the flex is soldered onto the individual
signal plane or subcomposite, while the other end of the flex is
connected to the other components (processor/memory) throug...