Browse Prior Art Database

Microprobe Structure for Solder-Bump Contact

IP.com Disclosure Number: IPCOM000115461D
Original Publication Date: 1995-May-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 4 page(s) / 76K

Publishing Venue

IBM

Related People

Hirano, T: AUTHOR [+2]

Abstract

Disclosed is a device (microprobe) to make electrical contacts to Integrated Circuits (IC) during burn-in test. This probe is fabricated on a silicon substrate by using the micromachining technology. Advantages of this microprobe includes high-density contact points, non-misalignment due to thermal expansion, low contact resistivity, and self-alignment capability.

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Microprobe Structure for Solder-Bump Contact

      Disclosed is a device (microprobe) to make electrical contacts
to Integrated Circuits (IC) during burn-in test.  This probe is
fabricated on a silicon substrate by using the micromachining
technology.  Advantages of this microprobe includes high-density
contact points, non-misalignment due to thermal expansion, low
contact resistivity, and self-alignment capability.

      Fig. 1 shows the microprobing array contacting to an LSI chip.
The lower figure is the magnified view of the contact part.
Microprobe consists of holes that are aligned to the position of the
solder bump, needles placed at the bottom of the hole, and metal
conductive lines.  The probe structure is fabricated on a silicon
substrate.  LSI chip is placed face-down on the probe.  This probe
structure has following advantages:  (1) High-density contact.  The
hole is fabricated using micromachining technology which has the
fabrication accuracy of micrometer order.  (2) Non-misalignment due
to thermal expansion.  The microprobe and the LSI chip is made of the
same material, silicon, so that the misalignment does not occur even
in elevated temperature that is used in burn-in test procedure.  (3)
Low contact resistivity.  The surface of the solder is usually
covered with solder-oxide film, which is insulating material.  The
needles placed at the contact breaks the oxide film, and good contact
between solder and metal line on the microprobe is e...