Browse Prior Art Database

Silk Screen Optimize to Apply a Great Deal of Paste

IP.com Disclosure Number: IPCOM000115500D
Original Publication Date: 1995-May-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Terada, M: AUTHOR

Abstract

Disclosed is a method by which silk screen print is utilizable for solder paste amount control. Especially, it is useful when various kinds of parts are mixed up and mounted on a Printed Circuit Board (PCB), which are fine pitch LSI, very small parts and connectors.

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Silk Screen Optimize to Apply a Great Deal of Paste

      Disclosed is a method by which silk screen print is utilizable
for solder paste amount control.  Especially, it is useful when
various kinds of parts are mixed up and mounted on a Printed Circuit
Board (PCB), which are fine pitch LSI, very small parts and
connectors.

      The silk screen print has a thickness giving it ability to make
an uneven surface on the PCB (Fig. 1).  When the silk screen print
encircles a solder pad, a greater amount of solder paste remains on
the PCB after the solder paste printing (Fig. 2).

      The distance between stencil surface and solder pad surface is
made by the silk screen print thickness.  Consequently, the solder
paste amount is increased by the silk screen print.