Browse Prior Art Database

Advanced Surface Mount Technology Thermode

IP.com Disclosure Number: IPCOM000115507D
Original Publication Date: 1995-May-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Boll, SE: AUTHOR [+2]

Abstract

An advanced surface mount technology thermode for soldering Gullwing Leaded devices is illustrated in the accompanying Figure. Non solder wettable thermode adapter 1, is attached to thermode base 2 with adapter retainer 3. Molten solder reservoir and when filled supplies molten solder to solder wettable thermode surfaces 5. Non solderable thermode adapter fingers 6, isolate discrete solder supply sites that correspond to the leads of the device being soldered.

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Advanced Surface Mount Technology Thermode

      An advanced surface mount technology thermode for soldering
Gullwing Leaded devices is illustrated in the accompanying Figure.
Non solder wettable thermode adapter 1, is attached to thermode base
2 with adapter retainer 3.  Molten solder reservoir and when filled
supplies molten solder to solder wettable thermode surfaces 5.  Non
solderable thermode adapter fingers 6, isolate discrete solder supply
sites that correspond to the leads of the device being soldered.

Attributes of the advanced Surface Mount Technology (SMT) thermode
include the following:
  o  Solder bridging is eliminated
  o  Component leads are soldered stress free
  o  Solder volume control of predeposited solder on PWBs is
      eliminated
  o  Solder volume compensation of thermode reduces component lead
      complanarity requirement
  o  Thermode adapter protects PWB from thermode contact which
      eliminates PWB damage