Browse Prior Art Database

Heatsink Attachment Method

IP.com Disclosure Number: IPCOM000115516D
Original Publication Date: 1995-May-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 25K

Publishing Venue

IBM

Related People

Matsumoto, T: AUTHOR [+2]

Abstract

Disclosed is a method of heatsink attachment.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Heatsink Attachment Method

      Disclosed is a method of heatsink attachment.

      The Figure shows the schematic design of the heatsink
attachment.  The studs (1) are jointed on the card (2) to support the
heatsink (3) at the through hole.  Thermal paste (4) is applied on
the Chip (5) surface.  The shoulder of the stud controls the gap
between the chip and heatsink in order not to cause damage on the
chip.  The plate springs (6) are inserted in the stud's slit to hold
the replaceable heatsink.

The studs may be jointed anywhere on card.