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Component Removal and Replacement Tool

IP.com Disclosure Number: IPCOM000115517D
Original Publication Date: 1995-May-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 55K

Publishing Venue

IBM

Related People

French, W: AUTHOR [+3]

Abstract

Removal and replacement of components, such as semiconductor chips, on printed circuit boards demands a rapid and precise operation if damage is to be avoided. In performing such an operation on a complex, miniaturized structure such as a computer planar board, a dedicated tool becomes virtually essential.

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Component Removal and Replacement Tool

      Removal and replacement of components, such as semiconductor
chips, on printed circuit boards demands a rapid and precise
operation if damage is to be avoided.  In performing such an
operation on a complex, miniaturized structure such as a computer
planar board, a dedicated tool becomes virtually essential.

      Figs. 1 and 2 show a tool which meets this need effectively.
The tool comprises two concentric cylinders.  The inner cylinder 1 is
connected to a vacuum system while the outer cylinder 2 is connected
to a heated nitrogen supply.  The inner cylinder is biased upwards by
a spring 3 and protrudes through the outer cylinder.  The cylinder 1
actuates a toggle switch 4 which toggles between settings which
control the gas supply to provide vacuum on and nitrogen on modes.
At the beginning of the operation the tool is in vacuum on mode.  The
inner cylinder is depressed against the spring on to the chip to be
repaired.  At a fixed depression the vacuum cuts out and the hot
nitrogen comes on.  This melts the solder whereupon the tool is
withdrawn, reactivating the vacuum and cutting off the nitrogen
supply.  The chip may then be disposed of.  The repair site is next
dressed with solder as per normal repair operations.  A new chip is
picked up by the tool and is offered to the repair site.  As before,
once the tool head is depressed to a set level the vacuum cuts out
and the hot nitrogen comes on.  The joint fo...