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Browse Prior Art Database

Solder Plated Resin Ball

IP.com Disclosure Number: IPCOM000115572D
Original Publication Date: 1995-May-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Ohkuma, H: AUTHOR [+2]

Abstract

This article describes a solder plated resin ball which is used as a flip-chip joining material between a pad of semiconductor chip and a pad of substrate. The solder plated resin ball consists of a resin ball inside, barrier metal layer such as plated Ni on the surface of the resin ball and wettable top surface such as plated solder as shown in Fig. 1 displays this structure.

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Solder Plated Resin Ball

      This article describes a solder plated resin ball which is used
as a flip-chip joining material between a pad of semiconductor chip
and a pad of substrate.  The solder plated resin ball consists of a
resin ball inside, barrier metal layer such as plated Ni on the
surface of the resin ball and wettable top surface such as plated
solder as shown in Fig. 1 displays this structure.

      Figs. 2 and 3 show examples of the application using
solder-plated resin balls.  Fig. 2 shows an example of its
application
as flip-chip joining material between chip and substrate.  Fig. 3
shows
another example of its application as stand-off joining material to
control the height of conventional flip-chip soldering joints.

      The advantages of using the solder-plated resin ball as
flip-chip joining material are described below:
  1.  Resin to improve the reliability on thermal stress
  2.  Resin to easily adjust the joining height by selecting resin
size
  3.  Ni barrier to prevent resin from being fatigued by moisture
       absorption
  4.  Solder to easily obtain self-alignment during reflow joining
       process
  5.  Solder to be easily replaced for semiconductor chip rework.