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Browse Prior Art Database

Recessed Integral Case Heat Sink for Notebook Computer

IP.com Disclosure Number: IPCOM000115576D
Original Publication Date: 1995-May-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Buller, ML: AUTHOR [+2]

Abstract

Disclosed here is a notebook computer cover design that allows the thermal conduction between the processor module and the case but that provides a recessed surface for the contact area, thus eliminating any potential human factors problems with "hot spots."

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 83% of the total text.

Recessed Integral Case Heat Sink for Notebook Computer

      Disclosed here is a notebook computer cover design that allows
the thermal conduction between the processor module and the case but
that provides a recessed surface for the contact area, thus
eliminating any potential human factors problems with "hot spots."

      Thermal management, particularly of the heat from the processor
chip, is a particular problem in notebook computers.  Convective air
flow is not possible because of limited space and the absence of air
vents in the covers.  Conductive heat transfer to the case may be
possible, but it can lead to "hot spots" on the case which may be
unacceptable from a human factors standpoint.

      The design objectives are accomplished by using a stamped and
formed plate which sits against the bottom outside cover of the
notebook.  An opening, slightly larger than the module to be cooled,
is molded in the outside cover of the notebook.  The plate is
designed such that it has an indented area at the same place as the
opening in the cover.  The inner surface of the indentation contacts
the processor chip.  The plate then serves as a heat spreader,
conducting heat away from the chip, and transferring it to the
environment, which is at a lower temperature than the inside of the
enclosure.  However, since the hottest area is at the processor
module, it is recessed inside the cover.  Any concerns for contact of
the operator with a hot spot are eliminate...