Browse Prior Art Database

Flip Chip Joint Site Design

IP.com Disclosure Number: IPCOM000115605D
Original Publication Date: 1995-May-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 19K

Publishing Venue

IBM

Related People

Nishimura, Y: AUTHOR [+2]

Abstract

Disclosed is a design of Flip Chip Joint Site in a chip carrier.

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This is the abbreviated version, containing approximately 100% of the total text.

Flip Chip Joint Site Design

      Disclosed is a design of Flip Chip Joint Site in a chip
carrier.

      The Figure shows the examples of this design.  The Flip Chip
Attach (FCA) pad is exposed in the polygon shape FCA coating window
and forms the FCA joint pad where the FCA carrier bump is to be made.
This design is effective in making a fine pitch FCA carrier bump.