Browse Prior Art Database

Disk File Carrier

IP.com Disclosure Number: IPCOM000115651D
Original Publication Date: 1995-Jun-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Edmunds, A: AUTHOR [+2]

Abstract

Subsystem mechanical designs for example for housing multiple disk drives, have developed a modular approach over the last 4 years. The current production subsystems have modular disk drives which are densely packaged in the product. The disk drives are mounted simply on a metal plate which when removed from the subsystem renders the disk file totally exposed to the user and thus at risk from mechanical and electrostatic handling damage. Both the reliability of the disk drives and the ergonomics of such a design makes the current file carriers less attractive to users.

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Disk File Carrier

      Subsystem mechanical designs for example for housing multiple
disk drives, have developed a modular approach over the last 4 years.
The current production subsystems have modular disk drives which are
densely packaged in the product.  The disk drives are mounted simply
on a metal plate which when removed from the subsystem renders the
disk file totally exposed to the user and thus at risk from
mechanical and electrostatic handling damage.  Both the reliability
of the disk drives and the ergonomics of such a design makes the
current file carriers less attractive to users.

      Both the ergonomics and reliability can be considerably
improved by mounting the disk drives in a plastic moulded enclosure
which is plated with electroless nickel over copper.  The enclosure
completely covers the disk drive except for air vents and prevents
users handling the drive directly.  The plating gives the enclosure
ESD protection and provides RFI screening.  The density of the design
makes the enclosure gaps around the disk drive small, typically 1.0
mm, which provides efficient cooling of the file because of the
higher air velocities around the file.  The moulded enclosure also
ensures that the carrier is positively located in its application by
flexures formed as part of the moulding.  The flexures ensure that
any mechanical play between the carrier and the host chassis is
eliminated as well as making electrical contact with the chassis via
the plati...