Browse Prior Art Database

Vacuum Lamination Oven

IP.com Disclosure Number: IPCOM000115677D
Original Publication Date: 1995-Jun-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 58K

Publishing Venue

IBM

Related People

Gorman, R: AUTHOR [+3]

Abstract

Disclosed is an invention that can take a stack of laminated chips apply heat and pressure in a vacuum environment and produce a solid Cube (Figs. 1 and 2).

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 88% of the total text.

Vacuum Lamination Oven

      Disclosed is an invention that can take a stack of laminated
chips apply heat and pressure in a vacuum environment and produce a
solid Cube (Figs. 1 and 2).

      The design consists of a vacuum chamber large enough to handle
four stacks of chips, a dual contact heating system, thermocouple
sensors are strategically placed within the vacuum chamber, a
mechanism to apply variable pressure to the chip stack throughout the
curing cycle, a vacuum system with capability of going to 10 to the
minus 3 tores and a control system to monitor and profile the
individual curing cycle of each chip stack.  A maximum temperature of
500 degrees centigrade is required to fuse the stack together.  There
also has to be a variable pressure of up to 600 psi applied, to each
stack, throughout the cycle.  Materials used have to be a
consideration along with their properties of out gassing within a
vacuum state.  The chamber is designed of stainless steel with a
hinged door, an O ring seal and a outer coiled cooling system.  The
heaters are mounted parallel they are contact and arranged so that
the sack of chips slide between them producing a sandwich affect.
The pressure is applied through a vertical piston, driven by servo
electric cylinders mounted on top of the vacuum chamber.  A stainless
steel bellows encloses the hole produced by the pressure applying
piston going through the top of the chamber.  Thermocouples which
sense heat are located in each...