Browse Prior Art Database

Anchor for High Density Liquid Crystal Display Tab

IP.com Disclosure Number: IPCOM000115710D
Original Publication Date: 1995-Jun-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Morimoto, M: AUTHOR [+2]

Abstract

Disclosed is a new solder anchor for high density Tape Automated Bonding (TAB) for Liquid Crystal Display (LCD). This solder anchor is small to arrange in narrow space on high density TAB and it reduces soldering process.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 85% of the total text.

Anchor for High Density Liquid Crystal Display Tab

      Disclosed is a new solder anchor for high density Tape
Automated Bonding (TAB) for Liquid Crystal Display (LCD).  This
solder anchor is small to arrange in narrow space on high density TAB
and it reduces soldering process.

      The Figure shows the example of TAB drawing with this new
anchor and assembly drawing.  New anchor is designed for half size
from current anchor.  For example, if anchor is a circle type, it
will be a half circle type.  And if it is a square, it will be a
rectangle of half square.  Because there is very narrow clearance
between a TAB and next TAB due to high density of TAB.  And anchors
are possible to allocate on only both edges and it is smaller than
current anchor design.  Soldering pad of current size is not changed
on printed circuit board.  Adjacent two new anchors will be soldered
like the current anchor.  The soldering process of anchor is the last
process of assembling, and the soldering method is to heat pre-topder
of pad on printed circuit board by soldering iron.  Above operation
is not changed the current soldering process.  To solder two half
size anchors on the current soldering pad is more reliable than to
solder a half size anchor to a half size soldering pad.  Important
things of soldering reliability is soldering area and solder amount.
And the new anchor is possible to reduce soldering process about 50%
because of soldering two anchors at once.  The so...