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Browse Prior Art Database

Cube Contact Heater Assembly

IP.com Disclosure Number: IPCOM000115753D
Original Publication Date: 1995-Jun-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Gorman, R: AUTHOR [+3]

Abstract

Disclosed is an invention that can laminate stack of chips located in a heated vacuum environment.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Cube Contact Heater Assembly

      Disclosed is an invention that can laminate stack of chips
located in a heated vacuum environment.

      The design consists of a heating system which can quickly heat
a stack of chips to a maximum temperature of 500º  Centigrade.
The operating environment is a vacuum state and the materials used
must have non-out gassing properties.  Due to the vacuum conditions
radiant heaters are out of the question contact heaters are the only
solution.  A pedestal with a monnel cast contact heater for the
stacking fixture to sit on with two side supports for the support of
the top cast contact heater which has to be flexible enough to float.
The total distance between the two heaters are slightly less than the
height of the stacking fixture which carriers the laminated chips.
The operator slips the fixture into the heater assembly which
produces a set up similar to a sandwich.  The contact heaters on the
top and bottom with the fixture seated in between.  When the contact
heaters are activated the fixture heats very quickly and desired
temperature throughout the stack of chips is quickly attained.
Commercial heaters are used and they are designed to our
specifications.  They must be able to withstand a pressure of 600 psi
which is applied to the stack of chips at various stages of the
curing cycle.