Browse Prior Art Database

NiFe/Cu Seed Layer for Plating Coil Cu in Magnetic Recording Heads

IP.com Disclosure Number: IPCOM000115836D
Original Publication Date: 1995-Jun-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Gdula, R: AUTHOR [+4]

Abstract

A process is disclosed which uses a NiFe/Cu seed layer for plating the coil copper layer used in magnetic recording heads.

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This is the abbreviated version, containing approximately 100% of the total text.

NiFe/Cu Seed Layer for Plating Coil Cu in Magnetic Recording Heads

      A process is disclosed which uses a NiFe/Cu seed layer for
plating the coil copper layer used in magnetic recording heads.

      The process conventionally used for plating the copper coils
and other associated metallurgy in magnetic recording heads requires
a seed layer which will adhere well to surfaces such as alumina and
hard baked resist insulation layers.  A copper seed layer alone will
not provide the adhesion required, so a Cr seed layer is
conventionally
used under the copper seed layer for the coil plating process.

      While the use of Cr/Cu seed layer provides adequate initial
adhesion, the Cr layer is subject to delamination under stresses
caused by thermal mismatches and the presence of trace impurities
which can initiate chemical activity.  Replacing the Cr adhesion
layer with NiFe provides both the initial adhesion required and also
provides improved long term reliability in the presence of stresses.

      A NiFe layer typically 50 to 250 angstroms is first sputter
deposited.  The Cu layer is then deposited in the same pumpdown to
form the NiFe/Cu seed layer for the Cu plating process.