Browse Prior Art Database

Batch-Produced Sliders with Tapers and Processes for their Fabrication

IP.com Disclosure Number: IPCOM000115840D
Original Publication Date: 1995-Jun-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 73K

Publishing Venue

IBM

Related People

Kuckhermann, V: AUTHOR [+4]

Abstract

Flight height, pitch angle, and other flying characteristics of sliders used in magnetic Direct Access Storage Device (DASD) applications are strongly dependent on a well designed taper. Tapers in conventional ceramic sliders are machined at individual row level by mechanical lapping; this conventional fabrication technique requiring mechanical grinding, cutting and lapping at individual row or slider levels resulted in high cost for slider/head fabrication. (*) has described an IC type technique to produce Si sliders with magnetic heads, but did not describe any possibile technique to produce a taper at the wafer level.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 53% of the total text.

Batch-Produced Sliders with Tapers and Processes for their Fabrication

      Flight height, pitch angle, and other flying characteristics of
sliders used in magnetic Direct Access Storage Device (DASD)
applications are strongly dependent on a well designed taper.  Tapers
in conventional ceramic sliders are machined at individual row level
by mechanical lapping; this conventional fabrication technique
requiring mechanical grinding, cutting and lapping at individual row
or slider levels resulted in high cost for slider/head fabrication.
(*) has described an IC type technique to produce Si sliders with
magnetic heads, but did not describe any possibile technique to
produce a taper at the wafer level.  The use of IC techniques as
described to batch fabricate sliders with front tapers controllably
at the wafer level using lithography and Reactive Ion Etching (RIE)
process; in the following, references are made to silicon wafers and
its batch process, although we emphasize that the present invention
is not limited to silicon wafer, but extendable to other types of
wafers like ferrite, carbon, zirconia and sapphire.

      As a further advantage of the here described taper machining
process, we have now the possibility to obtain non-straight (e.g.,
convex) taper angle profiles.

      The same technique can be applied to provide 'rounded' edges of
the air-bearing rails of the (silicon) slider, which may reduce
scratching of the disc.  This provides the advantage of CONTROLLED
"edge-blending", which was previously difficult due to the lack of
control in mechanical means to edge-blend rows of sliders.  The
technique disclosed here to edge-blend sliders rails at the wafer
level controllably will result in much improved tribology, especially
on thin-film disk.
  1.  Taper Machining of Si-sliders - The first step for a batch
       process for taper machining of Si-sliders performed on full
       Si-wafers is the production of a wedged resist profile...