Browse Prior Art Database

Wirebond Crossovers on Direct Chip Attach Applications

IP.com Disclosure Number: IPCOM000115851D
Original Publication Date: 1995-Jul-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Goodman, DE: AUTHOR [+2]

Abstract

A method of using wirebonds as small, low-cost signal interconnections in Direct Chip Attach (DCA) packaging is disclosed.

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This is the abbreviated version, containing approximately 100% of the total text.

Wirebond Crossovers on Direct Chip Attach Applications

      A method of using wirebonds as small, low-cost signal
interconnections in Direct Chip Attach (DCA) packaging is disclosed.

      DCA uses wirebonding as the method of connecting signals from
circuit traces to the Integrated Circuit (IC) die.  The same
wirebonding can be used to cross over signals and provide an
interconnection of signals.

      The Figure shows a typical IC wirebonding and the addition of
the crossovers to connect signals.