Browse Prior Art Database

Gold Stud Design for Magnetic Thin Film Heads

IP.com Disclosure Number: IPCOM000115881D
Original Publication Date: 1995-Jul-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Doss, SK: AUTHOR

Abstract

Disclosed is a method which provides a thin (10 Micron) conformal alumina overcoat layer deposited over the head and copper read/write leads. Gold studs are plated to the copper leads through etched vias in the alumina overcoat.

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Gold Stud Design for Magnetic Thin Film Heads

      Disclosed is a method which provides a thin (10 Micron)
conformal alumina overcoat layer deposited over the head and copper
read/write leads.  Gold studs are plated to the copper leads through
etched vias in the alumina overcoat.

      The current process, as shown in Fig. 1, provides 40 micron
mushroomed plated copper studs followed by a 40 micron alumina
overcoat layer.  The alumina overcoat layer is then lapped to a
planar surface to expose the copper studs.  A thin coating of gold (5
to 10 microns) is then plated over the copper studs for the purpose
of bonding lead wires ultrasonically.  In the present invention, as
shown in Fig. 2, 10 micron thick gold studs are plated directly to
the head lead copper pads and covered by a thin (10 microns) alumina
overcoat layer.  The overcoat is patterned using standard
photolithographic techniques and vias chemically etched  to expose
the gold pads for wire bonding.  This process eliminates the plating
step for the copper studs.  It also greatly reduces the alumina
overcoat thickness and lapping requirements.  Furthermore, the gold
pads exhibit strong adhesion to the underlaying copper pads
minimizing the change of stud pull-out during the ultrasonic wire
bonding process.