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Browse Prior Art Database

Mechanical Bonding Design for Large Planar Sputtering Targets

IP.com Disclosure Number: IPCOM000115893D
Original Publication Date: 1995-Jul-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Kojima, KA: AUTHOR [+2]

Abstract

Disclosed is a design for mechanically clamping non-magnetic sputtering targets to existing backing plates. The design replaces costly and hazardous chemical bonding methods that are generally used.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Mechanical Bonding Design for Large Planar Sputtering Targets

      Disclosed is a design for mechanically clamping non-magnetic
sputtering targets to existing backing plates.  The design replaces
costly and hazardous chemical bonding methods that are generally
used.

      The Figure shows the unique features of this design.  Those
features involve the use of a protective insert, a removable set
screw for vertical or horizontal alignment and a thin nut for
clamping.

      Clamping is accomplished by placing a sputtering target and
interface on top of the backing plate and then mounting the fastening
hardware and alignment pieces.

      The fastening hardware has been precisely designed to provide
the correct amount of clamping force without fracturing the
sputtering
target.