Browse Prior Art Database

Thermoelectric Cooling of Computer Devices

IP.com Disclosure Number: IPCOM000115917D
Original Publication Date: 1995-Jul-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Hisano, K: AUTHOR

Abstract

This article describes thermo-electric cooling of computer devices (CPU, memory controller or any other LSI's which needs cooling), where conventional cooling (natural heat dissipation using heat sink or air forced cooling using fan/blower, et al) are either not sufficient or not efficient and where those conventional cooling method cannot be employed due to space limitation for smaller sizing of the products. One of good example of thermo-electric cooling device is the one which uses Peltier Effect.

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Thermoelectric Cooling of Computer Devices

      This article describes thermo-electric cooling of computer
devices (CPU, memory controller or any other LSI's which needs
cooling), where conventional cooling (natural heat dissipation using
heat sink or air forced cooling using fan/blower, et al) are either
not sufficient or not efficient and where those conventional cooling
method cannot be employed due to space limitation for smaller sizing
of the products.  One of good example of thermo-electric cooling
device is the one which uses Peltier Effect.

      Embed thermo-electric cooling device in the computer device
which is tobe newly designed and needs cooling, or attach
thermo-electric device to the surface of the computer device which
has no provision inside for the thermo-electric cooling, but in a way
that the device heat can be absorbed most effectively.  If embedding
the thermo-electric device in the computer device package is not
feasible due to design limitation, such computer device may have heat
conductive material embedded in the package alternately so that
internal heat can be conducted to the device surface efficiently.  If
direct attachment of the thermo-electric cooling device is not
feasible due to space limitation surrounding the computer device, et
al, heat conductive material or heat conductive device, well formed,
may be used to connect the computer device and the thermo-electric
cooling device thermal-conductively.

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