Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Planarized Glob-Top Module

IP.com Disclosure Number: IPCOM000116236D
Original Publication Date: 1995-Aug-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 24K

Publishing Venue

IBM

Related People

Cutting, LR: AUTHOR [+2]

Abstract

Module components made using glob-top encapsulation of wire-bond chips are difficult to place with industry standard, high volume placement equipment. The epoxy glob is not co-planar with the bottom side, which is a requirement for placement.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Planarized Glob-Top Module

      Module components made using glob-top encapsulation of
wire-bond chips are difficult to place with industry standard, high
volume placement equipment.  The epoxy glob is not co-planar with the
bottom side, which is a requirement for placement.

      Machining (grind, mill, etc.) the top of the encapsulant
material creates a flat surface which is co-planar with the bottom of
the module.  This provides the required surface for placement
equipment, without sacrificing real estate on the module, requiring a
cap, or use of molding equipment.