Browse Prior Art Database

Conformal Cooling Plate with Immersed Heat Exchanger

IP.com Disclosure Number: IPCOM000116316D
Original Publication Date: 1995-Aug-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 56K

Publishing Venue

IBM

Related People

Anderson, TM: AUTHOR [+2]

Abstract

A method for cooling high powered card-mounted electronic modules in a high performance and cost-effective manner is disclosed. The concept seeks to apply the significant heat transfer performance and cooling capability of cold plate/liquid coolant technology to the irregular and non-rigid surface topology of card-mounted (101) heat dissipating electronic components (102).

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Conformal Cooling Plate with Immersed Heat Exchanger

      A method for cooling high powered card-mounted electronic
modules in a high performance and cost-effective manner is disclosed.
The concept seeks to apply the significant heat transfer performance
and cooling capability of cold plate/liquid coolant technology to the
irregular and non-rigid surface topology of card-mounted (101) heat
dissipating electronic components (102).

      A rigid structure (or frame) (103) serves as one side of an
enclosure containing a fluid (104) with good thermal and
environmental properties.  A conformal sheet (105) is bonded (106) to
the cold plate to form the balance of the fluid enclosure.  A key
aspect of the invention is the inclusion of an immersed heat
exchanger (107) located within the fluid volume to augment heat
transfer from the fluid.  The rigid frame could be made of a plastic
since it does no participate in the heat transfer.  A two-sided
embodiment of the invention is possible wherein two card sides (108)
are cooled by a single heat exchanger (109).  This option offers the
capability of greater packaging density.

      The conformal surface and the fluid volume are designed to
accommodate the irregular surface topology of the card as well as
card flexure.  Some structure will have to be provide to function as
the compressive force holding the PCB to the cooling hardware.  This
function could be easily accomplished by the enclosing sheetwork of a
book pa...