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Miniature Cooling Cascade Packaging

IP.com Disclosure Number: IPCOM000116338D
Original Publication Date: 1995-Sep-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 4 page(s) / 69K

Publishing Venue

IBM

Related People

Blum, A: AUTHOR [+2]

Abstract

Disclosed is a small cooling engine consisting of several miniature cooling elements of substantially the same type of construction. The overall refrigeration capacity is generated by these cooling elements. The packaging examples given below make use of the advantages of the miniature cooling elements to realize thermodynamically favorable miniature cooling cascades.

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Miniature Cooling Cascade Packaging

      Disclosed is a small cooling engine consisting of several
miniature cooling elements of substantially the same type of
construction.  The overall refrigeration capacity is generated by
these cooling elements.  The packaging examples given below make use
of the advantages of the miniature cooling elements to realize
thermodynamically favorable miniature cooling cascades.

      The example of a cooling engine shown in cross-section in Fig.
1B is a four-stage cooling cascade with each stage 2 consisting of
four miniature cooling elements 1, as shown in Fig. 1A.  Each stage 2
is cooling the compressed gas flowing into the next stage.  A
thermally isolated 6 heat exchanger 3 exchanges the heat between the
high pressure in-channel 4 and the low pressure out-channel 5.  The
assembly of unit parts shown in Fig. 1A easily allows to build up
cooling engines adaptable to specific needs and of high efficiency.

      Fig. 2 schematically shows a cooling cascade.  The incomimg gas
of high pressure P(1) is expanded to low pressure P(2) in the
miniature cooling elements E1 to E4 with the temperature stepwise
decreasing from T(0) to T(4).  This type of pneumatic cooler could
be used for cooling down chips and multichip modules below room
temperature to enhance the switching time.

      In the example, shown in Figs. 3A and 3B, the pneumatic cooler
7 is used for effectively transmiting the heat produced by multichip
module 8...