Browse Prior Art Database

Epoxy Module Routing Technique

IP.com Disclosure Number: IPCOM000116374D
Original Publication Date: 1995-Sep-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 4 page(s) / 82K

Publishing Venue

IBM

Related People

Davis, R: AUTHOR [+4]

Abstract

Disclosed is a technique to accurately, inexpensively route small epoxy modules from a larger panel.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Epoxy Module Routing Technique

      Disclosed is a technique to accurately, inexpensively route
small epoxy modules from a larger panel.

      The following is a process sequence to sever small epoxy
modules (that have chips on them) from a larger panel.

      In Fig. 1, the base (1) with dowel pins (6) protruding from top
and bottom sides is loaded into the optical router.  The base is
aligned to the router because the dowel pins are protruding downward
from the base (1) and fit into accurate holes drilled on the base
plate of the router.  The laminated lower plate, made from G10 (15)
and 90 durometer urethane (16) is screwed to the base.  The router
would then personalize the lower plate by routing chip pockets (12),
clearance grooves (14) and vacuum holes (24).

      In Fig. 2, the top plates, also laminated from G10 material
(18) and 90 durometer urethane (17), is placed on the top protruding
dowels (6) in Fig. 1.  The router would then machine horizontal slots
on one top plate then vertical slots on the other top plate.

      The panel (13) in Fig. 2 would be ready for routing.  It is
placed on the laminated lower plate (15 and 16), located by the
dowels (6) in Fig. 1.  The vacuum is turned on, holding the modules
securely.  The optical router would pick up the fiducials then
compensate for alignment error.  The horizontal top sheet is added on
the panel.  The clamping screws (3) in Fig. 1 are tightened, which
secures both sides of the panel (...