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Technique to Improve Plating Base Conductivity for More Uniform Plating

IP.com Disclosure Number: IPCOM000116403D
Original Publication Date: 1995-Sep-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 66K

Publishing Venue

IBM

Related People

Fu, WB: AUTHOR [+4]

Abstract

Electroplating of magnetic and nonmagnetic materials for electronic devices, typically takes place on electrically conductive ceramic substrates that are made to be nonconductive by depositing an insulating film (undercoat) between the substrate and the devices. Electroplating on the substrate takes place through patterns defined on a very thin conducting seed layer. In the case of thin film magnetic recording heads, a NiFe seed layer with thickness of 80 -100 nm which is vacuum deposited is typically used as a base for Permalloy (NiFe) plating. The conductivity of seed layer is low and the resistance from the edge of the wafer, where electrical contacts are made, to the center, increases with increasing the size of the substrate.

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Technique to Improve Plating Base Conductivity for More Uniform Plating

      Electroplating of magnetic and nonmagnetic materials for
electronic devices, typically takes place on electrically conductive
ceramic substrates that are made to be nonconductive by depositing an
insulating film (undercoat) between the substrate and the devices.
Electroplating on the substrate takes place through patterns defined
on a very thin conducting seed layer.  In the case of thin film
magnetic recording heads, a NiFe seed layer with thickness of 80 -100
nm which is vacuum deposited is typically used as a base for
Permalloy (NiFe) plating.  The conductivity of seed layer is low and
the resistance from the edge of the wafer, where electrical contacts
are made, to the center, increases with increasing the size of the
substrate.  The seed layer resistance causes a potential gradient
from the plating contacts to the center of the substrate, resulting
in non-uniform current distribution.  This in turn degrades the
thickness and composition uniformity of the plated films as well as
their magnetic properties.

      A method is taught of (1) providing a uniform, well
electrically conducted plating base on which magnetic and
non-magnetic alloys can be electroplated and (2) providing conditions
to obtain electroplated films that have uniform composition and
thickness across large substrates.  This procedure increases the
conductivity, enhances the current distribution and improves the
p...