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Resin DAM Pattern on Printed Circuit Board

IP.com Disclosure Number: IPCOM000116406D
Original Publication Date: 1995-Sep-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Ohkuma, H: AUTHOR [+2]

Abstract

Disclosed is a Resin Dam Pattern on Printed Circuit Board (PCB) which prevents the outflow of flux at solder pre-coating as developed by Supper Solder Technology Corp (SST) and at lead soldering. The resin DAM pattern keeps enough quantity of flux in the area to be soldered and/or solder coated, and also prevents solder balls from being flowed out to adjacent area. As a result, flux efficiency can be ensured with less solder balls.

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Resin DAM Pattern on Printed Circuit Board

      Disclosed is a Resin Dam Pattern on Printed Circuit Board (PCB)
which prevents the outflow of flux at solder pre-coating as developed
by Supper Solder Technology Corp (SST) and at lead soldering.  The
resin DAM pattern keeps enough quantity of flux in the area to be
soldered and/or solder coated, and also prevents solder balls from
being flowed out to adjacent area.  As a result, flux efficiency can
be ensured with less solder balls.

      Fig. 1 shows the example of the Resin DAM Pattern which is made
along the circumference of the soldering pads to prevent outflow of
the flux and/or the solder paste.

      Fig. 2 shows manufacturing flow of PCB with the Resin DAM
Pattern.  The resin DAM Pattern is made by ordinary resin material
such as heat cured resin, ultraviolet cure resist or expose photo
imageable resist.