Browse Prior Art Database

Double Expose for Black Matrix Patterning

IP.com Disclosure Number: IPCOM000116428D
Original Publication Date: 1995-Sep-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Goto, Y: AUTHOR [+2]

Abstract

Disclosed is a method to expose enough of the marginal portion of the glass substrate of the color filter for the Liquid Crystal Display (LCD) in the Black Matrix (BM) photo-lithography process.

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Double Expose for Black Matrix Patterning

      Disclosed is a method to expose enough of the marginal portion
of the glass substrate of the color filter for the Liquid Crystal
Display (LCD) in the Black Matrix (BM) photo-lithography process.

      The Figure shows the example of the process.  The resist is
coated on the substrate.  The resist thickness of the marginal
portion of the glass substrate is thicker than the others (2).  This
difference of the thickness causes the pattern blotch after
development.  The thicker resist requires the much light exposure.
The mask of which only the marginal portion transmits the light is
provided.  In order to apply the light to the marginal portion, the
second exposure using the said mask is applied (4) after the BM
pattern is exposed (3).  Because the marginal portion is well
exposed, the substrate is developed without blotch (5).

      As a result of this process, effective area of the glass
substrate can be wider.  This means the glass substrate can be
minimized.