Browse Prior Art Database

CMOS Circuit Temperature Modulator via On-Chip Temperature Sensor-Controlled Thermoelectric Element

IP.com Disclosure Number: IPCOM000116471D
Original Publication Date: 1995-Sep-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 64K

Publishing Venue

IBM

Related People

Chrysler, GM: AUTHOR [+2]

Abstract

A method of modulating the power induced temperature swings of CMOS microelectronic devices is presented. A feedback control circuit sensing the cooling air temperature and an On-Chip Temperature Sensor (OCTS) regulates the power input to a thermoelectric heat pump in intimate contact with the CMOS device.

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This is the abbreviated version, containing approximately 60% of the total text.

CMOS Circuit Temperature Modulator via On-Chip Temperature Sensor-Controlled
Thermoelectric Element

      A method of modulating the power induced temperature swings of
CMOS microelectronic devices is presented.  A feedback control
circuit sensing the cooling air temperature and an On-Chip
Temperature Sensor (OCTS) regulates the power input to a
thermoelectric heat pump in intimate contact with the CMOS device.

      Disclosed is a method of controlling or modulating the
temperature swings of CMOS circuits caused by the circuit utilization
induced power dissipation swings and/or air temperature changes.  The
Figure shows the basic concept.  A multichip (or single chip) module
(1) has CMOS chips (2) positioned on a substrate (3) it as is
typical.  A heat sink (4) is attached to the module cap (5) and
provides the means of dissipating the power of the chips to the
ultimate sink.  Positioned between the module and the heat sink is a
thermoelectric module (6), or modules.  A control circuit (7)
receives input from both the on chip temperature sensor (8) and the
cooling air temperature sensor (9).  The control circuit sends a
signal along a control line (10) to the thermoelectric module power
supply (11), which in turn controls the thermoelectric module power
via power leads (12).

      As the power dissipation of the CMOS chips increases, the
control circuit senses the corresponding temperature rise of the OCTS
and signals the thermoelectric module power su...