Browse Prior Art Database

Closed Cabinet Natural Convection Cooling

IP.com Disclosure Number: IPCOM000116505D
Original Publication Date: 1995-Sep-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Chrysler, GM: AUTHOR [+2]

Abstract

A packaging scheme for multiple printed circuit cards arranged on a common system or connecting board is disclosed. The assembly allows for the natural convection cooling of multiple printed circuit cards in a hostile environment while still allowing easy access for card removal or replacement.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 58% of the total text.

Closed Cabinet Natural Convection Cooling

      A packaging scheme for multiple printed circuit cards arranged
on a common system or connecting board is disclosed.  The assembly
allows for the natural convection cooling of multiple printed circuit
cards in a hostile environment while still allowing easy access for
card removal or replacement.

      A method of packaging electronic circuit modules in a dense
package while protecting them from the surroundings (moisture and/or
dust) and still providing for natural convection cooling and allowing
easy access to internal printed circuit cards is disclosed.  The
details are presented in the top and side views of the Figure.
Electronic circuit modules (1) are positioned on printed circuit
cards (2) as is typical.  The cards are connected to a common system
board (3) through standard edge connections.  The assembly of modules
on printed circuit cards, along with the system board is placed in a
sealable cabinet (4).  The cabinet, when closed, provides protection
from the environment.  Communication between the modules and the
outside world in accomplished through one or more hermetic
feed-throughs in the cabinet wall.  Between each printed circuit card
is placed a highly conductive internal fin (5).  These fins are
attached to the back wall of the cabinet.  The thermal energy
dissipated by the modules is transferred to the internal fins via
convection.  Conduction along the internal fins delivers the energy
to th...