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Improved Bellows for Wafer Process Cup

IP.com Disclosure Number: IPCOM000116531D
Original Publication Date: 1995-Sep-01
Included in the Prior Art Database: 2005-Mar-30
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Morou, P: AUTHOR [+2]

Abstract

The goal of the modification is to avoid leaks of developer and De-Ionized (DI) water into the motor/encoder parts of the developer spin-on equipment. Standard equipment designs for the resist development process are not well adapted to a manufacturing environment because they produce too many fails and result in a high cost of spare parts, thus, extra manpower for equipment maintenance.

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Improved Bellows for Wafer Process Cup

      The goal of the modification is to avoid leaks of developer and
De-Ionized (DI) water into the motor/encoder parts of the developer
spin-on equipment.  Standard equipment designs for the resist
development process are not well adapted to a manufacturing
environment because they produce too many fails and result in a high
cost of spare parts, thus, extra manpower for equipment maintenance.

      This problem is simply solved by introducing a TEFLON* bellows
in the developer spin-on equipment.  The bellows is placed between
the backside rinse adaptor (which supports the wafer chuck) on the
one hand and the frame containing the motor/encoder on the other
hand.  The bellows is adapted to provide a sealable link between the
parts while permitting the up and down movement of the motor spindle
attached to the adaptor.  The bellows, therefore, prevents any
ingress
of the developer in the sensitive parts of the spin-on equipment.
  *  Trademark of E. I. du Pont de Nemours and Company.